In one year since we released ANSYS RedHawk-SC — our next-generation, system-on-chip (SoC) power noise and reliability signoff solution — we’ve accomplished the amazing. One hundred percent of our 7nm RedHawk customers are using or deploying RedHawk-SC for signoff of their most complex and valuable products. Such designs are at the heart of the artificial intelligence (AI), autonomous vehicle, 5G, mobile and high-performance computing (HPC) revolution that is in play today.
We’ve also experienced strong business growth, including the displacement of our sole competitor’s product. While this competitor’s claims have been heralded on websites like DeepChip.com, we were proud to have their flagship customer present for ANSYS RedHawk-SC at the Design Automation Conference (DAC) in 2017, as well as in subsequent customer webinars. This customer, presenting again at DAC 2018, is one of the fastest growing public tech companies in the past year — and we’re privileged to be playing a role in its success. Watch this video that highlights many of the key reason why this customer adopted RedHawk-SC, including the solution’s:
- Unprecedented capacity and speed to handle a 20-billion transistor design.
- Multidomain analytics that enable early detection of timing/voltage problems.
- Scenario scoring and scenario coverage techniques, which allow an order of magnitude increase in simulation coverage.
- Ability to visualize chip scale data (layout, hotspots, multidomain analytics) in seconds or minutes, using commodity hardware. This is analogous to Google Maps
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mapping service on your cellphone — again, simply amazing!
The success of RedHawk-SC continues; customer adoption has accelerated significantly in 2018. For example, the growing number of chip startups — focused primarily on AI chips, with some on cryptocurrency — are great examples of new customers adopting RedHawk-SC. Additionally, we are seeing many system companies (automotive and communications, for example) joining the ranks of RedHawk-SC customers as they engage in high-value 7nm designs.
DAC 2018 is near — June 24, in San Francisco, California — and five of our key customers will share their success with our semiconductor solution. All told, we have dozens of top customers sharing their success using ANSYS products for multiphysics analyses of their chip-package-systems.
Along with Qualcomm and Synopsys, ANSYS will be presenting at a special dinner event Monday, June 25, and you’ll hear us talk about the work we’re doing with RedHawk-SC and Synopsys’ PrimeTime® and IC Compiler
(ICC II). Specifically, voltage-on-timing effects have emerged as a key customer need in 2018, and we will outline the compelling and complete workflow we’ve developed to address this challenge. I look forward to seeing you Monday night at the Synopsys PrimeTime Special Interest Group (SIG) dinner.
Finally, at DAC we are holding our annual executive briefing event Tuesday morning, along with distinguished speakers/panelists from Kobe University, Intel, TSMC and Arm Holdings who will be sharing key insights. It will be hosted by Ed Sperling of Semiconductor Engineering: register here. Our event last year was standing-room only, so register soon!
Check out our complete program at ANSYS@DAC and register for various best practice seminars to learn more. And, don’t forget to visit us in BOOTH #1637.
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